Home > Newly Shipped PCB > HDI Hybrid PCB 8-Layer 1.5mm RO4003C S1000-2M Advanced Impedance Control for RF and Microwave Circuits

8-Layer HDI Hybrid PCB
PCB Material:RO4003C + S1000-2M / 1.5mm
MOQ:1PCS
Price:49.99-199 USD/PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:12-18 working days
Payment Method:T/T, Paypal
 

HDI Hybrid PCB 8-Layer 1.5mm RO4003C S1000-2M Advanced Impedance Control for RF and Microwave Circuits


1. Introduction to RO4003C

Rogers RO4003C materials are proprietary woven glass reinforced hydrocarbon/ceramics that combine the electrical performance of PTFE/woven glass with the manufacturability of epoxy/glass. This design offers superior high-frequency performance and cost-effective circuit fabrication. The result is a low-loss material that can be fabricated using standard epoxy/glass (FR-4) processes at competitive prices.


RO4003C materials possess the necessary properties for designers of RF microwave circuits, matching networks, and controlled impedance transmission lines. Its low dielectric loss allows RO4003C to be used in applications where higher operating frequencies limit the use of conventional circuit board laminates. Available in various configurations, RO4003C laminates utilize both 1080 and 1674 glass fabric styles, all meeting the same laminate electrical performance specifications. RO4003C materials are non-brominated and do not have a UL 94 V-0 rating.


2. Features of RO4003C

Dielectric Constant: DK 3.38 ± 0.05 at 10GHz
Dissipation Factor: 0.0027 at 10GHz
Thermal Conductivity: 0.71 W/m/°K
Thermal Coefficient of Dielectric Constant: +40 ppm/°C, ranging from -50°C to 150°C
CTE Matched to Copper: X-axis 11ppm/°C, Y-axis 14ppm/°C
Low Z-Axis Coefficient of Thermal Expansion: 46 ppm/°C
Tg: >280 °C
Low Moisture Absorption: 0.06%


3. Features of S1000-2M

Low Z-Axis CTE: 2.4 ppm/°C, excellent through-hole reliability.
High Tg: 185 °C, high heat resistance for lead-free FR-4.
Low Water Absorption: 0.08%, humidity resistance.
T260: 60 minutes, T288: 30 minutes.
UL 94-V0 Flammability Rating.


4.Basic PCB Specifications

Basic PCB SpecificationsParameters
Board Type8 layers
Material TypeRO4003C + FR-4 Tg170 °C
Solder MaskBoth sides, Green
Silkscreen PrintTop side, White
Surface FinishENIG
Total Board Thickness1.5mm ± 10%
Board Size87.5mm x 40.6mm (1 piece)
Minimum Hole Size0.2mm
Solder Mask Thickness10µm
Minimum Dielectric Thickness100µm
Minimum Trace Line Width115µm
Minimum Spacing135µm
Blind ViaYes, L1-L2, L7-L8
Buried ViaYes, L2-L7
Back Drilled ViaYes, L1-L6
Impedance Controlled- 50 ohm, differential pairs, Top layer, 4mil / 4mil trace/gap, reference layer 2
- 100 ohm, differential pairs, Top layer, 5mil / 6mil trace/gap, reference layer 2
- 50 ohm, single-ended, Top layer, 6mil trace, reference layer 2
All 0.3mm ViasFilled and capped according to IPC 4761 Type VII
Edge PlatingRequired

5.PCB Stack-Up (Component Side at Top)

TYPELAYER NO.THICKNESS (µm)SPECIFICATION
COPPER14518µm BASE COPPER + 25µm PLATING
RO4003CCORE203IPC-4101/24
COPPER238
FR-4PP100IPC-4101/24
COPPER317
FR-4 S1000-2MCORE240IPC-4101/24
COPPER435
FR-4PP100IPC-4101/24
COPPER535
FR-4 S1000-2MCORE240IPC-4101/24
COPPER617
FR-4PP100IPC-4101/24
COPPER738
RO4003CCORE200IPC-4101/24
COPPER84518µm BASE COPPER + 25µm PLATING

8-Layer HDI Hybrid PCB Stackup


6. PCB Statistics

Components: 41
Total Pads: 73
Thru Hole Pads: 35
Top SMT Pads: 26
Bottom SMT Pads: 12
Vias: 57
Nets: 6


7. Type of Artwork Supplied

Gerber RS-274-X


8. Quality Standard

IPC-Class-2


9. Availability

Worldwide


8-Layer HDI Hybrid PCB


10. Some Typical Applications

Cellular Base Station Antennas and Power Amplifiers
RF Identification Tags
Automotive Radar and Sensors
LNBs for Direct Broadcast Satellites
Computing, Communication, Automotive Electronics


 

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